Formation of the Porous Film by Electroless Copper Plating.

Journal of Japan Institute of Electronics Packaging - Japan
doi 10.5104/jiep.1.66
Full Text
Abstract

Available in full text

Date
Authors
Publisher

Japan Institute of Electronics Packaging

Related search

Direct Electroless Copper Plating on Alumina Ceramics.

Circuit Technology
1989English

Indirect Determination of pH in Electroless Copper Plating Bath by Spectrophotometry.

Journal of the Metal Finishing Society of Japan
1985English

Laser-Enhanced Electroless Nickel Plating on Polyimide Film.

Journal of the Surface Finishing Society of Japan
1989English

Preparation and Characterization of Copper Powders With Sn Coating by the Electroless Plating

Acta Physica Polonica A
AstronomyPhysics
2015English

Application of Precision Filtration on Electroless Copper Plating Bath.

Journal of the Surface Finishing Society of Japan
1995English

Electroless Plating

Journal of the Japan Society of Colour Material
1996English

Direct Circuit Formation Method on Aluminum Substrate by Electroless Nickel Plating.

Journal of the Surface Finishing Society of Japan
1993English

Plasma Graft Copolymerization of 4-Vinylpyridine on Dense and Porous SiLK for Electroless Plating of Copper and for Retardation of Copper Diffusion

Journal of the Electrochemical Society
SurfacesCondensed Matter PhysicsOpticalElectrochemistrySustainabilityMaterials ChemistryMagnetic MaterialsRenewable EnergyFilmsCoatingsElectronicthe Environment
2005English

Electroless Plating of Paper

Sen'i Gakkaishi
Materials ScienceIndustrialPolymersManufacturing EngineeringPlasticsChemical Engineering
1986English

Amanote Research

Note-taking for researchers

Follow Amanote

© 2024 Amaplex Software S.P.R.L. All rights reserved.

Privacy PolicyRefund Policy