Amanote Research
Register
Sign In
Preparation and Characterization of Copper Powders With Sn Coating by the Electroless Plating
Acta Physica Polonica A
- Poland
doi 10.12693/aphyspola.127.1106
Full Text
Open PDF
Abstract
Available in
full text
Categories
Astronomy
Physics
Date
April 1, 2015
Authors
M. Uysal
T. Cetinkaya
H. Gul
M. Kartal
H. Algul
M. Tokur
A. Alp
H. Akbulut
Publisher
Institute of Physics, Polish Academy of Sciences
Related search
Formation of the Porous Film by Electroless Copper Plating.
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Direct Electroless Copper Plating on Alumina Ceramics.
Circuit Technology
Indirect Determination of pH in Electroless Copper Plating Bath by Spectrophotometry.
Journal of the Metal Finishing Society of Japan
Application of Precision Filtration on Electroless Copper Plating Bath.
Journal of the Surface Finishing Society of Japan
Electroless Plating
Journal of the Japan Society of Colour Material
Preparation of Platinum/Alumina Composite Membrane Using Electroless-Plating Technique.
Journal of the Surface Finishing Society of Japan
Preparation of High Stability Pd/Ceramic/Ti-Al Alloy Composite Membranes by Electroless Plating
Frontiers in Chemistry
Chemistry
Electroless Plating of Paper
Sen'i Gakkaishi
Materials Science
Industrial
Polymers
Manufacturing Engineering
Plastics
Chemical Engineering
Sn Plating to Replace Sn-Pb Plating
Journal of The Surface Finishing Society of Japan