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Three-Dimensional Chip-Multiprocessor Run-Time Thermal Management
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
- United States
doi 10.1109/tcad.2008.925793
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Categories
Electrical
Software
Computer Graphics
Computer-Aided Design
Electronic Engineering
Date
August 1, 2008
Authors
R.P. Dick
R. Joseph
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
