High Reliability of Automotive Electronics Products and Embedded Device Technologies

Journal of Japan Institute of Electronics Packaging - Japan
doi 10.5104/jiep.17.353
Full Text
Abstract

Available in full text

Date
Authors
Publisher

Japan Institute of Electronics Packaging

Related search

Trends in Automotive Electronics

International Journal of Engineering Applied Sciences and Technology
2019English

Semiconductor Materials and Processing for Automotive Electronics.

Materia Japan
1995English

Trends in High Density Packaging Technologies. Trends in Evaluation of Reliability With High Density Packaging Technologies-Present and Future in Evaluation of Reliability.

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
1997English

Substrate Modeling to Improve Reliability of High Voltage Technologies

2015English

Research on High Density SMT Reliability of Aerospace Products

2015English

Looking Back on Power Electronics Products for Automobile, and Mounting Technologies of Double-Side Cooling Power Module

Yosetsu Gakkai Shi/Journal of the Japan Welding Society
Mechanics of MaterialsSurfacesAlloysMechanical EngineeringMetalsFilmsCoatings
2011English

Corrosion in Electronics at Device Level

2010English

Electrostatic Discharge Risks in Electronics Used in Automotive Application

International Journal of Automotive Engineering and Technologies
2014English

Introduction. Carbon-Based Electronics: Fundamentals and Device Applications

Philosophical Transactions of the Royal Society A: Mathematical, Physical and Engineering Sciences
MathematicsEngineeringAstronomyPhysics
2007English

Amanote Research

Note-taking for researchers

Follow Amanote

© 2024 Amaplex Software S.P.R.L. All rights reserved.

Privacy PolicyRefund Policy