Suppressed Growth of (Fe, Cr, Co, Ni, Cu)Sn2 Intermetallic Compound at Interface Between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu0.5 Substrate During Solid-State Aging

Scientific Reports - United Kingdom
doi 10.1038/s41598-019-46757-w
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Springer Science and Business Media LLC

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