Retraction of "Development of a Ag/Glass Die Attach Adhesive for High Power and High Use Temperature Applications" [Transactions of the Japan Institute of Electronics Packaging, Vol. 9, Pp. E16-007-1–e16-007-6]
Transactions of The Japan Institute of Electronics Packaging
doi 10.5104/jiepeng.9.retr01_1
Full Text
Open PDFAbstract
Available in full text
Date
January 1, 2017
Authors
Publisher
Japan Institute of Electronics Packaging