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Bonding of Si Chips to Low Carbon Steel Boards Using Electroplated Sn Solder
Soldering and Surface Mount Technology
- United Kingdom
doi 10.1108/ssmt-04-2018-0011
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Categories
Electronic Engineering
Electrical
Condensed Matter Physics
Materials Science
Date
September 3, 2018
Authors
Shou-Jen Hsu
Chin C. Lee
Publisher
Emerald
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