Fine Pitch and Low Temperature Bonding Using Solder Bumps and the Assessment of Solder Joint Reliability

Materials Transactions- Japan

doi 10.2320/matertrans.48.37

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Abstract

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Categories

Mechanics of Materials

Materials Science

Condensed Matter Physics

Mechanical Engineering

Date

January 1, 2007

Authors

Seung-Min Chung

Publisher

Japan Institute of Metals

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