Control of Electrical and Thermal Properties on Sn–50Zn Alloy by 8 Vol%Al2O3 Addition for Pb-Free AC-Low Voltage Fuse Elements

Materials Transactions- Japan

doi 10.2320/matertrans.m2012335

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January 1, 2013

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Japan Institute of Metals

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Amanote Research

Control of Electrical and Thermal Properties on Sn–50Zn Alloy by 8 Vol%Al2O3 Addition for Pb-Free AC-Low Voltage Fuse Elements

Materials Transactions- Japan

Full Text

Abstract

Categories

Date

Authors

Publisher

Related search

Long Time Stability of Pb-Free Sn-9Zn Elements for AC-Low Voltage Fuse Performance

Properties of Electroplated Sn-Ag Alloy Films as Pb-Free Solderable Coating Obtained by Composite Plating.

Isothermal Fatigue Properties of Sn–Ag–Cu Alloy Evaluated by Micro Size Specimen

Effect of Addition of Small Amount of Zinc on Microstructural Evolution and Thermal Shock Behavior in Low-Ag Sn–Ag–Cu Solder Joints During Thermal Cycling

Electrodeposition of Sn-0.7Cu-0.3Ag Ternary Alloy From Methanesulfonate Bath for Pb-Free Soldering.

Effect of Addition of Cu on the Properties of Eutectic Sn-Bi Solder Alloy

Improvement of Hot Ductility of a Cu-4.4 Mol%Sn Alloy by Small Addition of Third Elements

Fatigue Damage Evaluation by Surface Feature for Sn–3.5Ag and Sn–0.7Cu Solders

Interface Reaction and Mechanical Properties of Lead-Free Sn-Zn Alloy/Cu Joints

Amanote Research

Control of Electrical and Thermal Properties on Sn&ndash;50Zn Alloy by 8 Vol%Al2O3 Addition for Pb-Free AC-Low Voltage Fuse Elements

Materials Transactions- Japan

Full Text

Abstract

Categories

Date

Authors

Publisher

Related search

Long Time Stability of Pb-Free Sn-9Zn Elements for AC-Low Voltage Fuse Performance

Properties of Electroplated Sn-Ag Alloy Films as Pb-Free Solderable Coating Obtained by Composite Plating.

Isothermal Fatigue Properties of Sn&ndash;Ag&ndash;Cu Alloy Evaluated by Micro Size Specimen

Effect of Addition of Small Amount of Zinc on Microstructural Evolution and Thermal Shock Behavior in Low-Ag Sn&ndash;Ag&ndash;Cu Solder Joints During Thermal Cycling

Electrodeposition of Sn-0.7Cu-0.3Ag Ternary Alloy From Methanesulfonate Bath for Pb-Free Soldering.

Effect of Addition of Cu on the Properties of Eutectic Sn-Bi Solder Alloy

Improvement of Hot Ductility of a Cu-4.4 Mol%Sn Alloy by Small Addition of Third Elements

Fatigue Damage Evaluation by Surface Feature for Sn&ndash;3.5Ag and Sn&ndash;0.7Cu Solders

Interface Reaction and Mechanical Properties of Lead-Free Sn-Zn Alloy/Cu Joints

Control of Electrical and Thermal Properties on Sn–50Zn Alloy by 8 Vol%Al2O3 Addition for Pb-Free AC-Low Voltage Fuse Elements

Isothermal Fatigue Properties of Sn–Ag–Cu Alloy Evaluated by Micro Size Specimen

Effect of Addition of Small Amount of Zinc on Microstructural Evolution and Thermal Shock Behavior in Low-Ag Sn–Ag–Cu Solder Joints During Thermal Cycling

Fatigue Damage Evaluation by Surface Feature for Sn–3.5Ag and Sn–0.7Cu Solders