Development of Millimeter-Wave ICs Using Flip-Chip Bonding Technology

Journal of SHM
doi 10.5104/jiep1993.12.2_3
Full Text
Abstract

Available in full text

Date
Authors
Publisher

Japan Institute of Electronics Packaging

Related search

Millimeter-Wave Flip-Chip IC Module.

Journal of SHM
1997English

Investigation of Flip-Chip Bonding for MEMS Applications

Journal of Electronic Packaging, Transactions of the ASME
Mechanics of MaterialsElectronic EngineeringOpticalComputer Science ApplicationsElectricalMagnetic MaterialsElectronic
2004English

Fluxless Flip-Chip Bonding of Single Photodetector Chips Using Laser-Induced Forward Transfer

2014English

Effect of Direction of Ultrasonic Vibration on Flip-Chip Bonding

Transactions of The Japan Institute of Electronics Packaging
2013English

Integrated Millimeter-Wave Antennas for On-Chip Communication

Advanced Electromagnetics
Electronic EngineeringRadiationOpticalElectricalMagnetic MaterialsElectronic
2016English

On-Chip Technology Independent 3-D Models for Millimeter-Wave Transmission Lines With Bend and Gap Discontinuity

Progress In Electromagnetics Research B
Electronic EngineeringCondensed Matter PhysicsOpticalElectricalMagnetic MaterialsElectronic
2010English

DEVELOPMENT OF FLIP CHIP TECHNIQUES FOR CONSTRUCTING MONOLITHIC MULTI-CHIP ARRAYS. Final Report.

1967English

Low-Temperature Direct Bonding of Flip-Chip Mountable VCSELs With Au-Au Surface Activation

IEEJ Transactions on Sensors and Micromachines
Electronic EngineeringElectricalMechanical Engineering
2008English

Reliability of Flip Chip Package^|^mdash;Thermal Stress on Flip Chip Joint^|^mdash;

Journal of Japan Institute of Electronics Packaging
Electronic EngineeringElectrical
2013English

Amanote Research

Note-taking for researchers

Follow Amanote

© 2024 Amaplex Software S.P.R.L. All rights reserved.

Privacy PolicyRefund Policy