On-Chip Technology Independent 3-D Models for Millimeter-Wave Transmission Lines With Bend and Gap Discontinuity

Progress In Electromagnetics Research B - United States
doi 10.2528/pierb10051806
Full Text
Abstract

Available in full text

Date
Authors
Publisher

EMW Publishing

Related search

Integrated Millimeter-Wave Antennas for On-Chip Communication

Advanced Electromagnetics
Electronic EngineeringRadiationOpticalElectricalMagnetic MaterialsElectronic
2016English

Development of Millimeter-Wave ICs Using Flip-Chip Bonding Technology

Journal of SHM
1996English

Millimeter-Wave Flip-Chip IC Module.

Journal of SHM
1997English

Low Noise Titanium Nitride KIDs for SuperSpec: A Millimeter-Wave On-Chip Spectrometer

Journal of Low Temperature Physics
Materials ScienceCondensed Matter PhysicsOpticsAtomicMolecular Physics,
2015English

Effect of Diffraction on Millimeter Wave Transmission Image of Wood

Zairyo/Journal of the Society of Materials Science, Japan
Mechanics of MaterialsMaterials ScienceCondensed Matter PhysicsMechanical Engineering
2014English

A Characterization Method of On-Chip Tee-Junction for Millimeter-Wave CMOS Circuit Design

2014English

Beam-Searching and Transmission Scheduling in Millimeter Wave Communications

2015English

Flip-Chip Distributed MEMS Transmission Lines (DMTLs) for Biosensing Applications

IEEE Transactions on Industrial Electronics
ControlSystems EngineeringComputer Science ApplicationsElectricalElectronic Engineering
2009English

Integrated GaAs Diode Technology for Millimeter and Submillimeter-Wave Components and Systems

Materials Research Society Symposium - Proceedings
Mechanics of MaterialsMaterials ScienceCondensed Matter PhysicsMechanical Engineering
2000English

Amanote Research

Note-taking for researchers

Follow Amanote

© 2024 Amaplex Software S.P.R.L. All rights reserved.

Privacy PolicyRefund Policy