(PDF) Drop Impact Reliability of Edge-Bonded Lead-Free Chip

Drop Impact Reliability of Edge-Bonded Lead-Free Chip Scale Packages

Microelectronics Reliability - United Kingdom

doi 10.1016/j.microrel.2009.05.003

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Abstract

Available in full text

Categories

Electronic Engineering

Condensed Matter Physics

Molecular Physics,

Magnetic Materials

Date

July 1, 2009

Authors

Albert Liddicoat

Nicholas Vickers

Brian J. Toleno

Dongkai Shangguan

David A. Geiger

Publisher

Elsevier BV

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