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Chip-Package Interaction and Crackstop Study for Cu∕Ultra Low-K Interconnects
doi 10.1063/1.3169259
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Date
January 1, 2009
Authors
Xuefeng Zhang
Ryan S. Smith
Rui Huang
Paul S. Ho
Paul S. Ho
Ehrenfried Zschech
Shinichi Ogawa
Publisher
AIP
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