Bonding System of Semiconductor.

HYBRIDS
doi 10.5104/jiep1985.5.4_30
Full Text
Abstract

Available in full text

Date
Authors
Publisher

Japan Institute of Electronics Packaging

Related search

Closed-From Solution of Thermo Elasxtoplastic Strains of Semiconductor Chip Bonding Structures.

Transactions of the Japan Society of Mechanical Engineers Series A
1992English

Thienoisoindigo-Based Semiconductor Nanowires Assembled With 2-Bromobenzaldehyde via Both Halogen and Chalcogen Bonding

Scientific Reports
Multidisciplinary
2018English

Subsurface Damage Profiling System for Semiconductor Material

1989English

A Semiconductor Pressure Sensing System for Monitoring of GIS

IEEJ Transactions on Sensors and Micromachines
Electronic EngineeringElectricalMechanical Engineering
1999English

Hydrogen Bonding Effect on the Fluorescence of Π-Electron System

Bulletin of the Chemical Society of Japan
Chemistry
1956English

Electric Readout of Magnetization Dynamics in a Ferromagnet-Semiconductor System

Applied Physics Letters
AstronomyPhysics
2006English

Romantic Love, Pair-Bonding, and the Dopaminergic Reward System.

English

An Automated System for Hydroxide Catalysis Bonding of Precision-Aligned Optical Systems

2019English

Thermoelectric Triangular (Kagome) Lattice D-Electron Oxide Semiconductor System

Journal of the Institute of Electrical Engineers of Japan
Electronic EngineeringElectrical
2008English

Amanote Research

Note-taking for researchers

Follow Amanote

© 2025 Amaplex Software S.P.R.L. All rights reserved.

Privacy PolicyRefund Policy