Stress Migration Phenomena of Cu Interconnects

doi 10.7567/ssdm.2003.c-5-1
Full Text
Abstract

Available in full text

Date
Authors
Publisher

The Japan Society of Applied Physics

Related search

Effects of Multi-Layer Graphene Capping on Cu Interconnects

Nanotechnology
Mechanics of MaterialsElectronic EngineeringMechanical EngineeringMaterials ScienceNanoscienceElectricalBioengineeringNanotechnologyChemistry
2013English

Experiments and Simulation of Stress Induced Voiding Dependence on Upper Metal Cap Layer in Cu/Low K Interconnects

2008English

Impact of Annealing on the Resistivity of Ultrafine Cu Damascene Interconnects

Materials Research Society Symposium - Proceedings
Mechanics of MaterialsMaterials ScienceCondensed Matter PhysicsMechanical Engineering
2003English

On the Ageing Phenomena of Cu-Co Alloys

Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of MaterialsAlloysMaterials ChemistryCondensed Matter PhysicsMetals
1968English

Growth Kinetics of Cu6Sn5 Intermetallic Compound at Liquid-Solid Interfaces in Cu/Sn/Cu Interconnects Under Temperature Gradient

Scientific Reports
Multidisciplinary
2015English

On the Reversion Phenomena of Cu-3%Ti Alloys

Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of MaterialsAlloysMaterials ChemistryCondensed Matter PhysicsMetals
1970English

Chip-Package Interaction and Crackstop Study for Cu∕Ultra Low-K Interconnects

2009English

Influence of Grain Size Distributions on the Resistivity of 80 Nm Wide Cu Interconnects

Materials Transactions
Mechanics of MaterialsMaterials ScienceCondensed Matter PhysicsMechanical Engineering
2007English

Relaxation of Thermal Stress by Dislocation Motion in Passivated Metal Interconnects

Journal of Materials Research
Mechanics of MaterialsMaterials ScienceCondensed Matter PhysicsMechanical Engineering
2004English

Amanote Research

Note-taking for researchers

Follow Amanote

© 2024 Amaplex Software S.P.R.L. All rights reserved.

Privacy PolicyRefund Policy