High Performance Seesaw Torsional CMOS-MEMS Relay Using Tungsten VIA Layer

Micromachines - Switzerland
doi 10.3390/mi9110579
Full Text
Abstract

Available in full text

Date
Authors
Publisher

MDPI AG

Related search

Hybrid Postprocessing Etching for CMOS-compatible MEMS

Journal of Microelectromechanical Systems
Electronic EngineeringElectricalMechanical Engineering
1997English

Improve of Physical Layer Security Performance of Wireless Relay Communication System

2016English

A Torsional Sensor for MEMS-based RMS Voltage Measurements

Advances in Radio Science
2008English

Study on a High Performance MEMS Infrared Thermopile Detector

Micromachines
ControlSystems EngineeringElectricalMechanical EngineeringElectronic Engineering
2019English

Performance Analysis of High Speed Domino CMOS Logic Circuits

International Journal of Computer Applications
2014English

Research on the Process Layer and Substation Layer Relay Protection in Smart Substation Relay Protection

Journal of Electronic Research and Application
2018English

CMOS-compatible Tungsten Heaters for Silicon Photonic Waveguides

2012English

High-Performance Integrated RF-MEMS: Part 1- The Process

2003English

Layer-By-Layer Assembly of High-Performance Electroactive Composites Using a Multiple Charged Small Molecule

English

Amanote Research

Note-taking for researchers

Follow Amanote

© 2025 Amaplex Software S.P.R.L. All rights reserved.

Privacy PolicyRefund Policy