High Performance Seesaw Torsional CMOS-MEMS Relay Using Tungsten VIA Layer

Micromachines - Switzerland
doi 10.3390/mi9110579
Full Text
Abstract

Available in full text

Date
Authors
Publisher

MDPI AG

Amanote Research

Note-taking for researchers

Follow Amanote

© 2026 Amaplex Software S.P.R.L. All rights reserved.

Privacy PolicyRefund Policy