Mathematical Model of Temperature Field Distribution in Thin Plates During Polishing With a Free Abrasive

MATEC Web of Conferences - France
doi 10.1051/matecconf/201710201004
Full Text
Abstract

Available in full text

Date
Authors
Publisher

EDP Sciences

Related search

Abrasive-Free Polishing of Hard Disk Substrate With H2o2-C4h10o2-Na2S2O5 Slurry

Friction
SurfacesFilmsCoatingsMechanical Engineering
2013English

Temperature Distribution in Impacted Plates

1973English

Development of a High Efficiency Polishing Technology Using Abrasive Control Technique With AC Electric Field for Glass Substrates

Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Mechanical Engineering
2011English

The Development of AC Electric Field Assisted Polishing for Silicon Carbide Substrates With Control of Abrasive Behavior

Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Mechanical Engineering
2013English

Material Removal in Ultrasonic Abrasive Polishing of Additive Manufactured Components

Applied Sciences (Switzerland)
InstrumentationMaterials ScienceFluid FlowEngineeringComputer Science ApplicationsProcess ChemistryTransfer ProcessesTechnology
2019English

Abrasive Processing and Polishing Technology. Latest Abrasive Materials and Finishing Processes.

Journal of the Surface Finishing Society of Japan
1998English

Parameter Optimization of Polishing M300 Mold Steel With an Elastic Abrasive

Mathematical Problems in Engineering
MathematicsEngineering
2018English

Free Vibration Analysis of Rotating Thin Twisted Plates.

Nippon Kikai Gakkai Ronbunshu, C Hen/Transactions of the Japan Society of Mechanical Engineers, Part C
Mechanics of MaterialsIndustrialMechanical EngineeringManufacturing Engineering
1995English

Cable Free Polishing

British Dental Journal
Dentistry
2020English

Amanote Research

Note-taking for researchers

Follow Amanote

© 2024 Amaplex Software S.P.R.L. All rights reserved.

Privacy PolicyRefund Policy