Amanote Research
Register
Sign In
Discover open access scientific publications
Search, annotate, share and cite publications
Publications by A. Kerkhoff
Compliant Press-Fit Technology Integrated Into a New Back Panel Packaging Approach
ElectroComponent Science and Technology
Related publications
Electronic Packaging Technology View From System Design. Packaging Technology Made New Capability in Electronics Use.
Journal of the Surface Finishing Society of Japan
Investigations Into Packaging Technology for Membrane-Based Thermal Flow Sensors
Journal of Sensors and Sensor Systems
Electronic Engineering
Electrical
Instrumentation
Paleontological Studies Integrated Into a New Evolutionary Zoology
Zoological Science
Animal Science
Zoology
US Panel Backs New Approach to Risk
Nature
Multidisciplinary
SLC/FCA Packaging Technology.
Journal of SHM
Managing Paediatric Growth Disorders: Integrating Technology Into a Personalised Approach
JCRPE Journal of Clinical Research in Pediatric Endocrinology
Child Health
Endocrinology
Perinatology
Pediatrics
Metabolism
Diabetes
Validation of FE Micromotions and Strains Around a Press-Fit Cup: Introducing a New Micromotion Measuring Technique
Annals of Biomedical Engineering
Biomedical Engineering
Special Articles: Theme of Advanced Assembly and Packaging Technology. Breakthrough in Packaging Technology.
Circuit Technology
Unmanned Systems Acquisition and Technology Development: Is a More Integrated Approach Required
