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Publications by Aida Todri
A Study of Tapered 3-D TSVs for Power and Thermal Integrity
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Hardware
Electronic Engineering
Electrical
Architecture
Software
Related publications
Temperature Properties of the Parasitic Resistance of Through-Silicon Vias (TSVs) in High-Frequency 3-D ICs
IEICE Electronics Express
Electronic Engineering
Condensed Matter Physics
Optical
Electrical
Magnetic Materials
Electronic
Simultaneous Power and Thermal Integrity Driven via Stapling in 3D ICs
IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers
Computer Science Applications
Computer Graphics
Computer-Aided Design
Software
Analysis and Design of Ultra-Wideband 3-Way Bagley Power Divider Using Tapered Lines Transformers
International Journal of Microwave Science and Technology
Electronic Engineering
Radiation
Electrical
Condensed Matter Physics
Voltage Propagation Method for 3-D Power Grid Analysis
3-D Real Dam Reservoir Model for Seasonal Thermal Density Flow
Environmental Engineering and Management Journal
Management
Monitoring
Policy
Law
Environmental Engineering
Pollution
Intelligent System for Efficiency Enhancing Program of Thermal Power Plant: A Case Study
International Journal of Advanced Research in Electrical, Electronics and Instrumentation Engineering
Physical Design Tradeoffs in Power Distribution Networks for 3-D ICs
3-D Thermal Field Analysis of 10kV High Voltage Switchgear
DEStech Transactions on Computer Science and Engineering
Thermal Isomerizations of 2-D-1-(E)-Propenylcyclobutanes to 4-D-3-Methylcyclohexenes
