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Publications by Asao Nishimura
Electronic Characteristics Changes of Semiconductor Devices Caused by Packaging Stress.
Transactions of the Japan Society of Mechanical Engineers Series A
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Thermal Stress Analysis of Electronic Packaging
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Investigation of the Effects of Mechanical Stress on Electrical Characteristics of Semiconductor Devices, With Reference to Stress Transducers.
Improvement of Turn-Off Characteristics of Semiconductor Power Devices by -10MeV Light Ion Implantation.
RADIOISOTOPES
Flow Characteristics of Epoxy Compounds for Encapsulation of Semiconductor Devices
Seikei-Kakou
Termo-Viscoelastic Numerical Analysis of Residual Stress Influenced by Material Properties in Semiconductor Devices.
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Semiconductor Physics and Semiconductor Devices
The Journal of the Institute of Television Engineers of Japan
Basics of Semiconductor Devices
Passivation of Semiconductor Devices.
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