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Publications by B.M. Romenesko
Steady-State Thermal Conductivity Measurements of AlN and SiC Substrate Materials
IEEE Transactions on Components, Hybrids and Manufacturing Technology
Electronic Engineering
Industrial
Manufacturing Engineering
Engineering
Optical
Electrical
Magnetic Materials
Electronic
Related publications
Thermal Shock Behavior of SiC-AlN/Mo Functionally Graded Materials.
Funtai Oyobi Fummatsu Yakin/Journal of the Japan Society of Powder and Powder Metallurgy
Alloys
Industrial
Mechanical Engineering
Metals
Materials Chemistry
Manufacturing Engineering
Ceramic Substrate Materials With High Thermal Conductivity.
Bulletin of the Japan Institute of Metals
A Steady-State Thermoreflectance Method to Measure Thermal Conductivity
Review of Scientific Instruments
Medicine
Instrumentation
Thermal Conductivity of Polycrystalline Aluminum Nitride (AlN) Ceramics
Ceramica
Composites
Ceramics
Determination of Thermal Conductivity of Inhomogeneous Orthotropic Materials From Temperature Measurements
Inverse Problems in Science and Engineering
Engineering
Computer Science Applications
Applied Mathematics
Rheological Properties and Thermal Conductivity of AlN–poly(propylene Glycol) Suspensions
Heat and Mass Transfer/Waerme- und Stoffuebertragung
Transfer Processes
Fluid Flow
Condensed Matter Physics
Steady State Thermal Conductivity Measurement Method of Specimens in Thickness and In-Plane Direction ~ Thermal Conductivity Measurement of TIMs and Multi-Layer Printed Wiring Boards ~
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Thermal Conductivity of Polypropylene-Based Materials
Thermal Conductivity Measurements of Thin-Film Resist
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
