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Publications by Babak Sehari
Three Dimensional Integration (3DI) of Semiconductor Circuit Layers: New Devices and Fabrication Process
Related publications
Overview and Outlook of Three-Dimensional Integrated Circuit Packaging, Three-Dimensional Si Integration, and Three-Dimensional Integrated Circuit Integration
Journal of Electronic Packaging, Transactions of the ASME
Mechanics of Materials
Electronic Engineering
Optical
Computer Science Applications
Electrical
Magnetic Materials
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Review of Wafer-Level Three-Dimensional Integration (3DI) Using Bumpless Interconnects for Tera-Scale Generation
IEICE Electronics Express
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Condensed Matter Physics
Optical
Electrical
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New Design Concept and Fabrication Process for Three-Dimensional Silicon Photonic Crystal Structures
Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
Engineering
Astronomy
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Issues of Three-Dimensional Nanometer Scale Analysis for Advanced Semiconductor Devices
Vacuum and Surface Science
Integration of Semiconductor and Ceramic Superconductor Devices for Microwave Applications
IEEE Transactions on Magnetics
Electronic Engineering
Optical
Electrical
Magnetic Materials
Electronic
Integration of PDMS and PMMA for Batch Fabrication of Microfluidic Devices
IFMBE Proceedings
Bioengineering
Biomedical Engineering
Fabrication of Malleable Three-Dimensional-Printed Customized Bolus Using Three-Dimensional Scanner
PLoS ONE
Multidisciplinary
Vacuum In-Situ Process for Semiconductor Materials and Devices.
SHINKU
Semiconductor Physics and Semiconductor Devices
The Journal of the Institute of Television Engineers of Japan
