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Publications by Brian J. Toleno

Effects of Reflow Profile and Thermal Conditioning on Intermetallic Compound Thickness for SnAgCu Soldered Joints

Soldering and Surface Mount Technology

Electronic Engineering

Condensed Matter Physics

Materials Science

English

Related publications

Growth Behavior of Intermetallic Compound in Dissimilar Al-Cu Joints Under Direct Current

Journal of Korean Institute of Metals and Materials

Magnetic Materials

English

Corrosion Resistance of Soldered Joints in Aluminum (Report 1)

Yosetsu Gakkai Shi/Journal of the Japan Welding Society

Mechanics of Materials

Mechanical Engineering

English

Corrosion Resistance of Soldered Joints in Aluminum (2nd Report)

Yosetsu Gakkai Shi/Journal of the Japan Welding Society

Mechanics of Materials

Mechanical Engineering

English

Profile Monitoring for Autocorrelated Reflow Processes With Small Samples

Process Chemistry

Chemical Engineering

English

Characteristics of Press-Soldered Joints of Copper With Dissimilar Materials.

Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society

Mechanics of Materials

Mechanical Engineering

English

Effects of Density Profile of MDF on Stiffness and Strength of Nailed Joints

Journal of Wood Science

English

Gold-Aluminium Intermetallic Compound Formation

ElectroComponent Science and Technology

English

Applications of TiAl-based Intermetallic Compound.

Keikinzoku/Journal of Japan Institute of Light Metals

Mechanics of Materials

Materials Chemistry

Mechanical Engineering

English

Effects of Debinding and Sintering Condition on Distortion of Sintered Compact of Injection Molded TiAl Intermetallic Compound.

Funtai Oyobi Fummatsu Yakin/Journal of the Japan Society of Powder and Powder Metallurgy

Mechanical Engineering

Materials Chemistry

Manufacturing Engineering

English