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Publications by C. J. Liu
Low Leakage Current Cu(Ti)/SiO2 Interconnection Scheme With a Self-Formed TiOx Diffusion Barrier
Applied Physics Letters
Astronomy
Physics
Related publications
Low Current Resistive Switching in Cu–SiO2 Cells
Applied Physics Letters
Astronomy
Physics
Diffusion Titanium Aluminizing of Nickel With (Ti, Zr)N Barrier Layer
Research Bulletin of the National Technical University of Ukraine "Kyiv Politechnic Institute"
Self-Formation of Ti-Rich Interfacial Layers in Cu(Ti) Alloy Films
Pulsed Electric-Current Bonding of SiC to Cu With Ti Intermediate Layer
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Formation Mechanism of Diffusion-Reaction Layer for a Cu/Ti Diffusion Couple Under Different Heating Methods
Materiali in Tehnologije
Polymers
Alloys
Plastics
Metals
A Low-Diffusion MUSCL Scheme for LES on Unstructured Grids
Computers and Fluids
Engineering
Computer Science
A Low-Diffusion MUSCL Scheme for LES on Unstructured Grids
Computers and Fluids
Engineering
Computer Science
A New Leakage-Resilient IBE Scheme in the Relative Leakage Model
Lecture Notes in Computer Science
Computer Science
Theoretical Computer Science
Improvement of Ta Barrier Film Properties in Cu Interconnection by Using a Non-Mass Separated Ion Beam Deposition Method
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
