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Publications by Chengjuan Yang
Development and Application of Molded Interconnect Devices
International Journal of Robotics Applications and Technologies
Related publications
Circuit Pattern Structuring of Molded Interconnect Devices by Transmission Laser Beam
Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Mechanical Engineering
Self-Organized Interconnect Method for Molecular Devices
Sofc Interconnect Development
Laser Microprocessing Technology and Its Application for Development of Medical Devices
THE JOURNAL OF JAPAN SOCIETY FOR LASER SURGERY AND MEDICINE
All-Zigzag Graphene Nanoribbons for Planar Interconnect Application
Journal of Applied Physics
Astronomy
Physics
Developing Offloading-Enabled Application Development Frameworks for Android Mobile Devices
A New Hybrid Method for H2s-Sensitive Devices Using WO3-based Film and ACF Interconnect
Measurement Science and Technology
Instrumentation
Engineering
Applied Mathematics
Growth and Properties of InGaAs/FeAl/InAlAs/InP Heterostructures for Buried Reflector/Interconnect Applications in InGaAs Thermophotovoltaic Devices
Subdiffraction Instrumentation Development and Application to the Elucidation of Biological Systems, Thin Films, and Organic Photovoltaic Devices
