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Publications by Chin C. Lee
Solid Solution Softening and Enhanced Ductility in Concentrated FCC Silver Solid Solution Alloys
Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Nanoscience
Nanotechnology
Fluxless Tin Bonding Process With Suppressed Intermetallic Growth
IEEE Transactions on Components, Packaging and Manufacturing Technology
Electronic Engineering
Industrial
Manufacturing Engineering
Optical
Electrical
Magnetic Materials
Electronic
Bonding of Si Chips to Low Carbon Steel Boards Using Electroplated Sn Solder
Soldering and Surface Mount Technology
Electronic Engineering
Electrical
Condensed Matter Physics
Materials Science
A Corrosion Study of Ag–Al Intermetallic Compounds in Chlorine-Containing Epoxy Molding Compounds
Journal of Materials Science: Materials in Electronics
Electronic Engineering
Biomedical Engineering
Condensed Matter Physics
Biomaterials
Electronic
Molecular Physics,
Biophysics
Optical
Electrical
Atomic
Magnetic Materials
Bioengineering
Optics
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Thin-Film Ferroelectric Materials and Their Applications
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Thermomechanical Processing of Metallic Glasses: Extending the Range of the Glassy State
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Nickelates Enter the Scene
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Antagonistic Actuation and Stiffness Control in Soft Inflatable Robots
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Publisher Correction: Theory-Guided Design of Catalytic Materials Using Scaling Relationships and Reactivity Descriptors
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Seeing Hydrogen
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Publisher Correction: Probing Dynamics in Quantum Materials With Femtosecond X-Rays
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Chemically Diverse and Multifunctional Hybrid Organic–inorganic Perovskites
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Predicting Perfect Pores
Nature Reviews Materials
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A Storey of Buildings and Materials
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