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Publications by D. Tribula
Stress Relaxation in 60Sn-40Pb Solder Joints
Journal of Electronic Materials
Electronic Engineering
Condensed Matter Physics
Optical
Materials Chemistry
Electrical
Magnetic Materials
Electronic
The Nb3Sn Grain Structure Evolution in Bronze-Processed Multifilamentary Superconducting Wire
Journal of the Less Common Metals
Related publications
Strength Evaluation and Realiability of Micro-Joining. Fatigue Behavior of 60Sn/40Pb Solder.
Zairyo/Journal of the Society of Materials Science, Japan
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Prediction of Fatigue Failure of 60Sn-40Pb Solder Using Constitutive Model for Cyclic Viscoplasticity.
Transactions of the Japan Society of Mechanical Engineers Series A
Properties of Sn-Ag-Bi-In Solder Joints
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Solder Joints Detection Method Based on Surface Recovery
Computer and Information Science
Microstructural Evolution of Eutectic Au-Sn Solder Joints
Deformation Evaluation of Solder Ball Joints by Electromotive Force
Applied Mechanics and Materials
Residual Stress Relaxation in Typical Weld Joints and Its Effect on Fatigue and Crack Growth
Acta Metallurgica Sinica (English Letters)
Alloys
Industrial
Manufacturing Engineering
Metals
The Characteristics of Electromigration and Thermomigration in Flip Chip Solder Joints
The Effect of Solder Paste Viscosity on Porosity and Mechanical Properties of Surface Mount Solder Joints
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
