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Publications by Daikichi TACHIBANA

New Etching System Using Alkylimidazolato Copper(II) Film as Etching Resist.

Circuit Technology

English

Related publications

Chemical Etching and Plating Characteristics of Vapor Deposited Copper Film Using High Purity Copper Sources.

Journal of the Surface Finishing Society of Japan

English

Colorimetric Sensing of Copper(II) Based on Catalytic Etching of Gold Nanoparticles

Analytical Chemistry

English

A Novel Chemical Etching Reagent for Copper.

Journal of the Metal Finishing Society of Japan

English

Additive Effects on the Etching of Copper Using Sulfuric Acid / Hydrogen Peroxide Solution

Journal of The Surface Finishing Society of Japan

English

Feedback Control of Plasma Etching Reactors for Improved Etching Uniformity

Chemical Engineering Science

Applied Mathematics

Chemical Engineering

Manufacturing Engineering

English

Influence of Crystallographic Structure on Etching Rate of Copper by Using Ammonium Peroxodisulfate Solution

Journal of Japan Institute of Electronics Packaging

Electronic Engineering

English

Concentrating on Etching

Multidisciplinary

Philosophy of Science

English

Ultradeep Fused Silica Glass Etching With an HF-resistant Photosensitive Resist for Optical Imaging Applications

Journal of Micromechanics and Microengineering

Mechanics of Materials

Electronic Engineering

Mechanical Engineering

Magnetic Materials

English

A Novel Thermally Evaporated Etching Mask for Low-Damage Dry Etching

IEEE Transactions on Nanotechnology

Electronic Engineering

Computer Science Applications

English