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Publications by Dieter Schroder
Electromigration of Electroplated Gold Interconnects
Materials Research Society Symposium - Proceedings
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Some Recent Advances in Contactless Silicon Characterization
Related publications
Mechanism of Electromigration Failure in Al Thin Film Interconnects Containing Sc
Materials Research Society Symposium - Proceedings
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Modeling the Electromigration Failure Time Distribution in Short Copper Interconnects
Journal of Applied Physics
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In Situ X-Ray Microscopy Studies of Electromigration in Copper Interconnects
AIP Conference Proceedings
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Reproducible Interconnects Assembled From Gold Nanorods
Applied Physics Letters
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Significance of Inclusions in Electroplated Gold Films for Electronics Applications
Gold Bulletin
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Inorganic Chemistry
Influence of Microstructure and Internal Stress on the Mechanical Behavior of Electroplated Gold Freestanding Thin FIlms
EPJ Web of Conferences
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Thermoelectric Properties of Electroplated BiTe Thin Films
New Physics: Sae Mulli
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Alloy Electroplated Steel Sheet.
Journal of the Surface Finishing Society of Japan
Electromigration of Cell Surface Macromolecules During Galvanotaxis
Biophysical Journal
Biophysics
