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Publications by E. Brauns
Investigations Into Packaging Technology for Membrane-Based Thermal Flow Sensors
Journal of Sensors and Sensor Systems
Electronic Engineering
Electrical
Instrumentation
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Hot-Film and Calorimetric Thermal Air Flow Sensors Realized With Printed Board Technology
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Semiconductor Packaging Technology for 3D Assembly
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Compliant Press-Fit Technology Integrated Into a New Back Panel Packaging Approach
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An Universal Packaging Technique for Low-Drift Implantable Pressure Sensors
Biomedical Microdevices
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SLC/FCA Packaging Technology.
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[Geothermal Resource/Reservoir Investigations Based on Heat Flow and Thermal Gradient Data for the US]. 6. Quarterly Technical Progress Report
Special Articles: Theme of Advanced Assembly and Packaging Technology. Breakthrough in Packaging Technology.
Circuit Technology
Editorial for Journal of Packaging Technology and Research
Journal of Packaging Technology and Research
Editorial for Journal of Packaging Technology and Research
Journal of Packaging Technology and Research
