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Publications by Eiji HAGIMOTO
Packaging Technology of BGA/CSP. Tape-Type BGA/CSP Technology.
The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
Related publications
Structure and Subject of BGA/CSP Attractive New Packages.
Yosetsu Gakkai Shi/Journal of the Japan Welding Society
Mechanics of Materials
Surfaces
Alloys
Mechanical Engineering
Metals
Films
Coatings
Surface Mount Technology Fine Pitch BGA.
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
The Trend of Bonding Technology for CSP & FC.
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Synchrotron Micro-XRF Measurements of Trace Element Distributions in BGA Type Solders and Solder Joints
Transactions of The Japan Institute of Electronics Packaging
A BGA Package Routing Algorithm on Sketch Layout System.
The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
Mining (Soft-) Skypatterns Using Dynamic CSP
Lecture Notes in Computer Science
Computer Science
Theoretical Computer Science
Low-Loss, High-Q Spiral Inductor for Wafer Level CSP Using Cu Interconnect Technology With Polyimide Isolation Layer.
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
CSP: Bem Comum Da Saúde Coletiva
Cadernos de Saude Publica
Medicine
Environmental
Public Health
Occupational Health
Special Articles: Theme of Advanced Assembly and Packaging Technology. Breakthrough in Packaging Technology.
Circuit Technology
