(PDF) Low-Loss, High-Q Spiral Inductor for Wafer Level CSP

Low-Loss, High-Q Spiral Inductor for Wafer Level CSP Using Cu Interconnect Technology With Polyimide Isolation Layer.

Journal of Japan Institute of Electronics Packaging - Japan

doi 10.5104/jiep.7.247

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Abstract

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Categories

Electronic Engineering

Date

January 1, 2004

Authors

Publisher

Japan Institute of Electronics Packaging

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