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Publications by F. Mazel
A 3D Wideband Package Solution Using McM-D BCB Technology for Tile TR Module
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Package-Interposer-Package (PIP): A Breakthrough Package-On-Package (PoP) Technology for 3d-Integration
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Trends of MCM Application. Recent Technology Trends on MCM Organic Substrates.
The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
Continuous Ultrafiltration/Diafiltration Using a 3D‐printed Two Membrane Single Pass Module
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