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Publications by F.M. Hosking

NCMS PWB Program Report Surface Finishes Team Task WBS No. 3.1.1: Phase 1, Etching Studies: Chemical Etching of Copper for Improved Solderability

1995English

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A Novel Chemical Etching Reagent for Copper.

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Chemical Etching of Silicon

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New Etching System Using Alkylimidazolato Copper(II) Film as Etching Resist.

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Chemical Etching and Plating Characteristics of Vapor Deposited Copper Film Using High Purity Copper Sources.

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Studies of Membrane Structure by Freeze--Etching. Progress Report, 1 July 1974--30 June 1975

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Surface Chemistry During Plasma Etching of Silicon

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Chemical Foaming Coupled Self-Etching: A Multiscale Processing Strategy for Ultrahigh-Surface-Area Carbon Aerogels

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Anisotropic Chemical Etching of III—V Crystals Dissolution Slowness Surface and Application to GaAs

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