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Publications by G. Van Steenberge

Fluxless Flip-Chip Bonding of Single Photodetector Chips Using Laser-Induced Forward Transfer

English

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Development of Millimeter-Wave ICs Using Flip-Chip Bonding Technology

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Waveguide Mode Filter Fabricated Using Laser-Induced Forward Transfer

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Investigation of Flip-Chip Bonding for MEMS Applications

Journal of Electronic Packaging, Transactions of the ASME

Mechanics of Materials

Electronic Engineering

Computer Science Applications

Magnetic Materials

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Effect of Direction of Ultrasonic Vibration on Flip-Chip Bonding

Transactions of The Japan Institute of Electronics Packaging

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Laser-Induced Forward Transfer From Healing Silver Paste Films

Applied Physics Letters

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Substrate-Embedded and Flip-Chip-Bonded Photodetector Polymer-Based Optical Interconnects: Analysis, Design, and Performance

Journal of Lightwave Technology

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Inspection of Flip-Chip Epoxy Underfill in Microelectronic Assemblies Using Compensated Laser-Based Ultrasonic Receivers

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Fabrication of Phase-Change Chalcogenide Ge_2Sb_2Te_5 Patterns by Laser-Induced Forward Transfer

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Low-Temperature Direct Bonding of Flip-Chip Mountable VCSELs With Au-Au Surface Activation

IEEJ Transactions on Sensors and Micromachines

Electronic Engineering

Mechanical Engineering

English