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Publications by Guiquan Han
A Flexible Nanobrush Pad for the Chemical Mechanical Planarization of Cu/Ultra-Low-К Materials
Nanoscale Research Letters
Materials Science
Nanotechnology
Condensed Matter Physics
Nanoscience
Related publications
Chemical Mechanical Planarization of Copper Damascene Structures
Journal of the Electrochemical Society
Surfaces
Condensed Matter Physics
Optical
Electrochemistry
Sustainability
Materials Chemistry
Magnetic Materials
Renewable Energy
Films
Coatings
Electronic
the Environment
5-Phenyl-1-H-Tetrazole as a Low-pH Passivating Agent for Copper Chemical Mechanical Planarization
Journal of the Electrochemical Society
Surfaces
Condensed Matter Physics
Optical
Electrochemistry
Sustainability
Materials Chemistry
Magnetic Materials
Renewable Energy
Films
Coatings
Electronic
the Environment
In Situ Temperature Measurement During Oxide Chemical Mechanical Planarization
Materials Research Society Symposium - Proceedings
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Correlating Removal Rate to Directivity in Copper Chemical Mechanical Planarization
ECS Journal of Solid State Science and Technology
Optical
Electronic
Magnetic Materials
The Impact of Chemical Mechanical Planarization Polishing on a Surface Textured With Deterministic Microasperities
Stochastic Models for Material Removal Rate (MRR) in Chemical Mechanical Planarization (CMP) Process
Solution Deposition Planarization of Long-Length Flexible Substrates
Applied Physics Letters
Astronomy
Physics
Multi-Sensor Monitoring System in Chemical Mechanical Planarization (CMP) for Correlations With Process Issues
CIRP Annals - Manufacturing Technology
Industrial
Mechanical Engineering
Manufacturing Engineering
A Flexible Pad-Printed Fluxgate Sensor
Proceedings
