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Publications by H.-H. Park
Optoelectronic and Microwave Transmission Characteristics of Indium Solder Bumps for Low-Temperature Flip-Chip Applications
IEEE Transactions on Advanced Packaging
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Electrolytic Deposition of Fine Pitch Sn/Cu Solder Bumps for Flip Chip Packaging
International Symposium on Microelectronics
Microstructure and Mechanical Properties of Sn–0.7Cu Flip Chip Solder Bumps Using Stencil Printing Method
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Mechanics of Materials
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The Characteristics of Electromigration and Thermomigration in Flip Chip Solder Joints
Fine Pitch and Low Temperature Bonding Using Solder Bumps and the Assessment of Solder Joint Reliability
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Solder Paste Reflow Modeling for Flip Chip Assembly
Flip-Chip Distributed MEMS Transmission Lines (DMTLs) for Biosensing Applications
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Investigation of Flip-Chip Bonding for MEMS Applications
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Low Melting Temperature Solder Materials for Use in Flexible Microelectronic Packaging Applications
Low-Dimensional Nanostructures for Optoelectronic Applications
Journal of Nanomaterials
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Nanotechnology
Nanoscience