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Publications by Hideo HONMA

Application of Precision Filtration on Electroless Copper Plating Bath.

Journal of the Surface Finishing Society of Japan

English

Surface Technology for the 21st Century. Fabrication of Electrodeposited Ni Microprobes With a High Aspect Ratio.

Journal of the Surface Finishing Society of Japan

English

Direct Electroless Copper Plating on Alumina Ceramics.

Circuit Technology

English

Aluminum Surface Modification for High Adhesion Between Insulation Resin and Aluminum

Journal of Japan Institute of Electronics Packaging

Electronic Engineering

English

Formation of the Porous Film by Electroless Copper Plating.

Journal of Japan Institute of Electronics Packaging

Electronic Engineering

English

Smooth Circuit Formation on Cycloolefin Polymers

Journal of Japan Institute of Electronics Packaging

Electronic Engineering

English

Plating Time Dependence of Filling Ability With Additives by Copper Electroplating.

Journal of Japan Institute of Electronics Packaging

Electronic Engineering

English

Electroless Nickel Plating on the Fine Pattern Using Mixed Plating Bath Containing Hydrazine and Hypophosphite

Journal of Japan Institute of Electronics Packaging

Electronic Engineering

English