Amanote Research
Register
Sign In
Discover open access scientific publications
Search, annotate, share and cite publications
Publications by Hideo SENOO
Novel Pressure-Sensitive Bonding Tape in the Three-Dimensional Chip Stacking
Journal of The Adhesion Society of Japan
Related publications
High-Aspect-Ratio Copper via Filling Used for Three-Dimensional Chip Stacking
Journal of the Electrochemical Society
Surfaces
Condensed Matter Physics
Optical
Electrochemistry
Sustainability
Materials Chemistry
Magnetic Materials
Renewable Energy
Films
Coatings
Electronic
the Environment
Mapping Three-Dimensional Temperature in Microfluidic Chip
Scientific Reports
Multidisciplinary
Three-Dimensional Imaging for Indirect-Direct Bonding
American Journal of Orthodontics and Dentofacial Orthopedics
Orthodontics
Three-Dimensional Chip-Multiprocessor Run-Time Thermal Management
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Electrical
Software
Computer Graphics
Computer-Aided Design
Electronic Engineering
A Novel Three‐dimensional Contact Finite Element Based on Smooth Pressure Interpolations
International Journal for Numerical Methods in Engineering
Applied Mathematics
Numerical Analysis
Engineering
PC222. Engineered Vascular Grafts Using Three-Dimensional Printed Guides and the Ring Stacking Method
Journal of Vascular Surgery
Surgery
Cardiovascular Medicine
Cardiology
Low-Temperature Wafer Bonding for Three-Dimensional Wafer-Scale Integration
Recent Advances in Three-Dimensional Pressure Relieving Cushions for the Prevention of Pressure Ulcers
Journal of the Textile Institute
Materials Science
Industrial
Polymers
Manufacturing Engineering
Plastics
Biological Sciences
Agricultural
On-Chip Three-Dimensional Cell Culture in Phaseguides Improves Hepatocyte Functions in Vitro
Biomicrofluidics
Materials Science
Genetics
Condensed Matter Physics
Molecular Biology
Colloid
Fluid Flow
Nanoscience
Theoretical Chemistry
Transfer Processes
Surface Chemistry
Biomedical Engineering
Nanotechnology
Physical
