Amanote Research
Register
Sign In
Discover open access scientific publications
Search, annotate, share and cite publications
Publications by Hiroyuki Kadota
Investigation on Microstructure and Resistivity in Cu-TSVs for 3D Packaging
Transactions of The Japan Institute of Electronics Packaging
Related publications
3D Networks-On-Chip Mapping Targeting Minimum Signal TSVs
IEICE Electronics Express
Electronic Engineering
Condensed Matter Physics
Optical
Electrical
Magnetic Materials
Electronic
Investigation of Microstructure in Solid State Welded Al-Cu-Li Alloy
MATEC Web of Conferences
Materials Science
Engineering
Chemistry
Resistivity of Cu-Ni/Cu/Cu-Ni Multilayer Materials
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Semiconductor Packaging Technology for 3D Assembly
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Relationship Between Microstructure and Properties of Cu-Cr-Ag-(Ce) Alloy Using Microscopic Investigation
Scanning
Instrumentation
Optics
Atomic
Molecular Physics,
3D Resistivity Survey for Shallow Subsurface Fault Investigations
E3S Web of Conferences
Earth
Energy
Planetary Sciences
Environmental Science
Resistivity of Cu/Ni Multilayer Materials
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
3d-Printed End-Of-Arm for Smarter Packaging
Laser Technik Journal
Impact of Annealing on the Resistivity of Ultrafine Cu Damascene Interconnects
Materials Research Society Symposium - Proceedings
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
