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Publications by I. C. Ryu

The Results of Self Annealing Process for a Copper Interconnection on the 4xnm DRAM Products

English

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Formation of ULSI Interconnection by Copper Electrodeposition Process Using the Pre-Adsorption of Polyethylene Glycol Derivative

Journal of The Surface Finishing Society of Japan

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Annealing Effects on the Properties of Copper Selenide Thin Films for Thermoelectric Applications

IOSR Journal of Applied Physics

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A DRAM Backend for the Impulse Memory System

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Adaptive-Latency DRAM: Optimizing DRAM Timing for the Common-Case

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The Estimate of Demand Elastic for the Products of Copper Industry on International Market

Bulletin of the Moscow University named S U Vitte Series 1 Economics and management

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Oxide-Nitride Storage Dielectric Formation in a Single-Furnace Process for Trench DRAM

IEEE Electron Device Letters

Electronic Engineering

Magnetic Materials

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The Colored Refresh Server for DRAM

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The Effect of Primary Copper Slag Cooling Rate on the Copper Valorization in the Flotation Process

Metallurgical and Materials Engineering

Mechanical Engineering

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Results on the Dimension Spectrum for Self-Conformal Measures

Nonlinear Physics

Applied Mathematics

Mathematical Physics

English