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Publications by Ikuo SHOHJI
Investigation of Degradation Behavior of Cohesion of Resin and Adhesion Interface Under High Temperature and High Humidity Conditions
Journal of Smart Processing
The Influence of Additives in Electroless Nickel Plating Film on the Reliability of Solder Joint
Journal of The Surface Finishing Society of Japan
Evaluation of Corrosion Resistance of SUS304 Stainless Steel Joint Brazed With Fe-Cr System Alloy
Journal of Smart Processing
Growth Kinetics of Intermetallic Compounds on the Boundary Between Au and In-48Sn Solder.
The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
Rupture Life of CSP Solder Joints With Sn-Ag Lead-Free Solders Under Thermal Cycle Condition.
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
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