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Publications by Ikuo SHOHJI

Investigation of Degradation Behavior of Cohesion of Resin and Adhesion Interface Under High Temperature and High Humidity Conditions

Journal of Smart Processing
2019English

The Influence of Additives in Electroless Nickel Plating Film on the Reliability of Solder Joint

Journal of The Surface Finishing Society of Japan
2012English

Evaluation of Corrosion Resistance of SUS304 Stainless Steel Joint Brazed With Fe-Cr System Alloy

Journal of Smart Processing
2015English

Growth Kinetics of Intermetallic Compounds on the Boundary Between Au and In-48Sn Solder.

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
1998English

Rupture Life of CSP Solder Joints With Sn-Ag Lead-Free Solders Under Thermal Cycle Condition.

Journal of Japan Institute of Electronics Packaging
Electronic EngineeringElectrical
2001English

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