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Publications by J F Creemer
Wafer-Level Assembly and Sealing of a MEMS Nanoreactor Forin Situmicroscopy
Journal of Micromechanics and Microengineering
Mechanics of Materials
Electronic Engineering
Mechanical Engineering
Nanoscience
Optical
Electrical
Magnetic Materials
Nanotechnology
Electronic
Related publications
Temporary Wafer Bonding – Key Technologogy for MEMS Devices
Nanoindustry Russia
Size-Compatible, Polymer-Based Air-Gap Formation Processes, and Polymer Residue Analysis for Wafer-Level MEMS Packaging Applications
Journal of Electronic Packaging, Transactions of the ASME
Mechanics of Materials
Electronic Engineering
Optical
Computer Science Applications
Electrical
Magnetic Materials
Electronic
Nano-Probing Station Incorporating MEMS Probes for 1D Device RF On-Wafer Characterization
Design and Wafer-Level Fabrication of SMA Wire Microactuators on Silicon
Journal of Microelectromechanical Systems
Electronic Engineering
Electrical
Mechanical Engineering
A Review on Key Issues and Challenges in Devices Level MEMS Testing
Journal of Sensors
Control
Systems Engineering
Instrumentation
Electrical
Electronic Engineering
High-Efficient Chip to Wafer Self-Alignment and Bonding for Flexible and Size-Free MEMS-IC Integration
IEEJ Transactions on Sensors and Micromachines
Electronic Engineering
Electrical
Mechanical Engineering
In-Package MEMS-based Thermal Actuators for Micro-Assembly
Journal of Micromechanics and Microengineering
Mechanics of Materials
Electronic Engineering
Mechanical Engineering
Nanoscience
Optical
Electrical
Magnetic Materials
Nanotechnology
Electronic
Stability of Wafer Level Vacuum Encapsulated Single-Crystal Silicon Resonators
Substrate Sorting by a Supercharged Nanoreactor
