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Publications by J. Bea
10-Μm-Pitch In-Au Microbump Interconnection by Chip Self-Assembly With Excimer Lamp Irradiation for 3D LSI Applications
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Excimer Lamp and Applications
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Liquid Phase Bonding Using Au Compliant Bumps for Fine-Pitch Solder Bump Interconnection
Autofluorescence of Electrophoresis Chip Grooved by Excimer Laser
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Bare Chip LSI and Hybrid Packaging.
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A Single-Chip NMOS Analog Front-End LSI for Modems
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3D Self-Assembly: Remotely Controlled Microscale 3D Self-Assembly Using Microwave Energy (Adv. Mater. Technol. 8/2017)
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Formation of Low Resistance Nonalloyed Ti∕Au Ohmic Contacts to N-Type ZnO by KrF Excimer Laser Irradiation
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