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Publications by Jared Jones
Experimental and Numerical Investigation of Interdie Thermal Resistance in Three-Dimensional Integrated Circuits
Journal of Electronic Packaging, Transactions of the ASME
Mechanics of Materials
Electronic Engineering
Optical
Computer Science Applications
Electrical
Magnetic Materials
Electronic
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Thermal Model for Three-Dimensional Integrated Circuits With Integrated MLGNR-based TSV
Thermal Science
Renewable Energy
the Environment
Sustainability
Numerical Modelling of Three-Dimensional Thermal Surface Discharges
Engineering Applications of Computational Fluid Mechanics
Modeling
Computer Science
Simulation
Dynamic Electrothermal Simulation of Three-Dimensional Integrated Circuits Using Standard Cell Macromodels
IET Circuits, Devices and Systems
Control
Systems Engineering
Electrical
Electronic Engineering
Experimental and Numerical Investigation of Powder Vaporization Under Thermal Plasma Conditions
Le Journal de Physique Colloques
Numerical Investigation and Experimental Validation of a Novel Thermal Architecture for Spacecraft Thermal Management
Overview and Outlook of Three-Dimensional Integrated Circuit Packaging, Three-Dimensional Si Integration, and Three-Dimensional Integrated Circuit Integration
Journal of Electronic Packaging, Transactions of the ASME
Mechanics of Materials
Electronic Engineering
Optical
Computer Science Applications
Electrical
Magnetic Materials
Electronic
Modeling of 3-Dimensional Defects in Integrated Circuits
Numerical and Experimental Investigation on the Thermal Behaviour of the Building Integrating Occupant Thermal Comfort
MATEC Web of Conferences
Materials Science
Engineering
Chemistry
Experimental Investigation of Mounting Thermal Resistance of Flatpacks on Circuit Boards
IEEE Transactions on Components, Hybrids and Manufacturing Technology
Electronic Engineering
Industrial
Manufacturing Engineering
Engineering
Optical
Electrical
Magnetic Materials
Electronic
