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Publications by Ji-Hyuk Ahn
Effect of Multiple Reflows on the Mechanical Reliability of Solder Joint in LED Package
Journal of Korean Institute of Metals and Materials
Surfaces
Alloys
Metals
Simulation
Optical
Magnetic Materials
Films
Modeling
Coatings
Electronic
Related publications
The Influence of Additives in Electroless Nickel Plating Film on the Reliability of Solder Joint
Journal of The Surface Finishing Society of Japan
Fine Pitch and Low Temperature Bonding Using Solder Bumps and the Assessment of Solder Joint Reliability
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Effect of Electroless Ni-P / Electrolytic Cu Plating on Solder Joint Reliability Under High Temperature Environment of 200 ℃
Journal of The Surface Finishing Society of Japan
The Effect of Solder Paste Viscosity on Porosity and Mechanical Properties of Surface Mount Solder Joints
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
Coarsening of the Sn-Pb Solder Microstructure in Constitutive Model-Based Predictions of Solder Joint Thermal Mechanical Fatigue
Journal of Electronic Materials
Electronic Engineering
Condensed Matter Physics
Optical
Materials Chemistry
Electrical
Magnetic Materials
Electronic
Novel Photosensitive Solder Resist With High Reliability for Semiconductor Package(II)
Journal of Photopolymer Science and Technology
Organic Chemistry
Polymers
Materials Chemistry
Plastics
Reliability of Flip Chip Package^|^mdash;Thermal Stress on Flip Chip Joint^|^mdash;
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
SAC–xTiO2 Nano-Reinforced Lead-Free Solder Joint Characterizations in Ultra-Fine Package Assembly
Soldering and Surface Mount Technology
Electronic Engineering
Electrical
Condensed Matter Physics
Materials Science
Solder Joints Reliability Prediction. Thermo-Mechanical Fatigue: The Models Based on Creep Strain. Part 2
ELECTRONICS: Science, Technology, Business
