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Publications by Jillian Y. Evans
Quality Conformance and Qualification of Microelectronic Packages and Interconnects
Journal of Electronic Packaging, Transactions of the ASME
Mechanics of Materials
Electronic Engineering
Optical
Computer Science Applications
Electrical
Magnetic Materials
Electronic
Related publications
Electron Tomography of Microelectronic Device Interconnects
Microscopy and Microanalysis
Instrumentation
Ga-Based Alloys in Microelectronic Interconnects: A Review
Materials
Materials Science
Condensed Matter Physics
Mid-Film Interconnects for Multilayer Microcircuit Packages
ElectroComponent Science and Technology
Fatigue Crack Propagation Along Polymer-Metal Interfaces in Microelectronic Packages
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
Unifying Agile Requirements Specification Quality Control and Implementation Conformance Assurance
Mechanical and Electrical Characterisation of Au Wire Interconnects in Electronic Packages Under the Combined Vibration and Thermal Testing Conditions
Microelectronics Reliability
Surfaces
Electronic Engineering
Condensed Matter Physics
Electronic
Molecular Physics,
Nanoscience
Films
Optical
Electrical
Atomic
Magnetic Materials
Nanotechnology
Reliability
Safety
Coatings
Optics
Quality
Risk
Physical and Physiological Quality of Safflower Seed Stored in Different Packages and Temperatures
Journal of Agricultural Science
Conformance of Malaysia E-Commerce Blogs With Quality Content Theories
Journal of Internet and e-Business Studies
Extending Storage Period and Shelf Life and Maintaining Quality of Dill Using Microperforated Polypropylene Packages
Zagazig Journal of Agricultural Research
