Amanote Research
Register
Sign In
Discover open access scientific publications
Search, annotate, share and cite publications
Publications by Jong-Hoon Back
Effect of Thin ENEPIG Plating Thickness on Interfacial Reaction and Brittle Fracture Rate of Sn-3.0Ag-0.5Cu Solder Joints
Journal of Welding and Joining
Related publications
Evaluation of Absorbed Impact Energy of Sn-3.0Ag-0.5Cu (-xCo) Solder Joints With Co-P Plating a Using Ball Impact Test
Transactions of The Japan Institute of Electronics Packaging
Creep-Fatigue Life Assessment for Sn-3.0Ag-0.5Cu Solder
Journal of Solid Mechanics and Materials Engineering
Effect of TiO2 Nanoparticles on the Horizontal Hardness Properties of Sn-3.0Ag-0.5Cu-1.0TiO2 Composite Solder
Ceramics International
Surfaces
Optical
Materials Chemistry
Process Chemistry
Technology
Magnetic Materials
Films
Composites
Electronic
Coatings
Ceramics
Effect of Shear Speed on the Ball Shear Strength of Sn-3Ag-0.5Cu Solder Ball Joints
Transactions of The Japan Institute of Electronics Packaging
Interfacial Reactions in Sn-57Bi-1Ag Solder Joints With Cu and Au Metallization
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Effect of Zn Addition on Interfacial Reactions Between Sn-4Ag Solder and Ag Substrates
Journal of Electronic Materials
Electronic Engineering
Condensed Matter Physics
Optical
Materials Chemistry
Electrical
Magnetic Materials
Electronic
Effect of Iron Plating Conditions on Reaction in Molten Lead-Free Solder
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Suppressed Growth of (Fe, Cr, Co, Ni, Cu)Sn2 Intermetallic Compound at Interface Between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu0.5 Substrate During Solid-State Aging
Scientific Reports
Multidisciplinary
Properties of Sn-Ag-Bi-In Solder Joints
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
