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Publications by Juil Yoon
Singular Stress Fields at Corners in Flip-Chip Packages
Engineering Fracture Mechanics
Mechanics of Materials
Materials Science
Mechanical Engineering
Inorganic Islands on a Highly Stretchable Polyimide Substrate
Journal of Materials Research
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Related publications
Reliability of Flip Chip Package^|^mdash;Thermal Stress on Flip Chip Joint^|^mdash;
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Wafer-Level Flip Chip Packages Using Preapplied Anisotropic Conductive Films (ACFs)
IEEE Transactions on Electronics Packaging Manufacturing
Analysis of Chip/Bump/Ceramic Interface of Flip-Chip Bonded LED Directly on Ceramic Packages
Journal of Light and Visual Environment
Electronic Engineering
Electrical
Development of the Singular Stress Analyses for Three-Dimensional Interfacial Corners
Transactions of the JSME (in Japanese)
Trend of BGACSPKGD. Flip-Chip Chip Size/Scale Package.
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Millimeter-Wave Flip-Chip IC Module.
Journal of SHM
Investigation of Flip-Chip Bonding for MEMS Applications
Journal of Electronic Packaging, Transactions of the ASME
Mechanics of Materials
Electronic Engineering
Optical
Computer Science Applications
Electrical
Magnetic Materials
Electronic
Solder Paste Reflow Modeling for Flip Chip Assembly
DEVELOPMENT OF FLIP CHIP TECHNIQUES FOR CONSTRUCTING MONOLITHIC MULTI-CHIP ARRAYS. Final Report.
