Amanote Research
Register
Sign In
Discover open access scientific publications
Search, annotate, share and cite publications
Publications by K. H. Kelleher
Tantalum as a Diffusion Barrier Between Copper and Silicon: Failure Mechanism and Effect of Nitrogen Additions
Journal of Applied Physics
Astronomy
Physics
Related publications
Diffusion in Copper-Rich Copper-Silicon Alloys
Materials Transactions, JIM
Hot Tearing of Aluminum–copper B206 Alloys With Iron and Silicon Additions
Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Nanoscience
Nanotechnology
Use of WNx as Diffusion Barrier for Copper Airbridged Low Noise GaAs PHEMT
Electronics Letters
Electronic Engineering
Electrical
Fast Through-Bond Diffusion of Nitrogen in Silicon
Applied Physics Letters
Astronomy
Physics
Breaking the Electrical Barrier Between Copper and Carbon Nanotubes
Nanoscale
Materials Science
Nanotechnology
Nanoscience
Improving the Morphological Stability of Nickel Germanide by Tantalum and Tungsten Additions
Applied Physics Letters
Astronomy
Physics
Reaction Diffusion Between Thermal Sprayed Aluminium and Copper Substrate
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Pseudomonas Aeruginosa Biofilm as a Diffusion Barrier to Piperacillin.
Antimicrobial Agents and Chemotherapy
Infectious Diseases
Pharmacology
Reactive Diffusion Between Ultra High Purity Iron and Silicon Wafer
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
